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HSML-C265 Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard)

Part # HSML-C265
Description  AlInGaP chipLED
PDF  5 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSML-C265 Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard)

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Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the
product(s) at anytime.
5
Figure 3: Tape Dimensions
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MINIMUM OF
230mm
(9.05in.) MAY
CONSIST OF
CARRIER
AND/OR
COVER TAPE
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface Mounting SMT LED
Indicator Components.
Storage Condition : 5
to 30 OC @ 60%RH max.
Baking
is required under
the condition :
a) the
blue
silica
gel
indicator
becoming
white
/
transparent
color
b) the pack has been open
for more than 1 week
Baking recommended
condition : 60 ± 5 OC for
20 hrs
Figure 4: Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
www.semiconductor.agilent.com
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
Revision Date: xx-xx-xxxx



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