µ PC29xx Series

20

Data Sheet G10026EJ4V0DS

Through-hole devices

µPC29xxHF Series, µPC29xxHF-AZ Series Note1: Isolated TO-220 (MP-45G)

µPC29xxHB Series, µPC29xxHB-AZ Series Note1, µPC29xxHB-AY Series Note2: SC-64 (MP-3)

Process

Conditions

Symbol

Wave soldering

Solder temperature: 260

°C or below,

WS60-00-1

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Pin temperature: 350

°C or below,

P350

Heat time: 3 seconds or less (Per each pin).

Notes 1. Pb-free (This product does not contain Pb in the external electrode.)

2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

CAUTION ON USE

When using the

µPC29xx series at the input voltage which is lower than in the recommended operating condition,

the high quiescent current flows through devices because the transistor of the output paragraph is saturated (Refer

to “IBIAS (IBIAS (s)) vs VIN curves in TYPICAL CHARACTERISTICS”). The

µPC29xx series have saturation protection

circuits, but they sometimes need about 80 mA current. Therefore the power supply on the input needs the enough

current capacity to pass this quiescent current when the devices startup.

REFERENCE DOCUMENTS

USER'S MANUAL USAGE OF THREE TERMINAL REGULATORS

Document No.G12702E

REVIEW OF QUALITY AND RELIABILITY HANDBOOK

Document No.C12769E

INFORMATION VOLTAGE REGULATOR OF SMD

Document No.G11872E

SEMICONDUCTOR DEVICE MOUNT MANUAL

http://www.necel.com/pkg/en/mount/index.html

<R>