NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(3) The bypass capacitor should be attached to VCC line.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Soldering Conditions

Condition Symbol

Infrared Reflow

Peak temperature (package surface temperature)

: 260

°C or below

Time at peak temperature

: 10 seconds or less

Time at temperature of 220

°C or higher

: 60 seconds or less

Preheating time at 120 to 180

°C

: 120

±30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

IR260

VPS

Note

Peak temperature (package surface temperature)

: 215

°C or below

Time at temperature of 200

°C or higher

: 25 to 40 seconds

Preheating time at 120 to 150

°C

: 30 to 60 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

VP215

Wave Soldering

Peak temperature (molten solder temperature)

: 260

°C or below

Time at peak temperature

: 10 seconds or less

Preheating temperature (package surface temperature) : 120

°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

WS260

Partial Heating

Peak temperature (pin temperature)

: 350

°C or below

Soldering time (per side of device)

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

HS350

Note Excluding lead-free products

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PU10171EJ03V0DS

16

µPC3221GV