The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -

1. Contact Resistance: 40mΩ (Max.)

change.

2. No damage

duration 24 hours.

Connectors detached

(EIA-364-26A)

SOLDER ABILITY

Item

Requirement

Test Condition

Solder-ability

95% of immersed area must show no

voids, pin holes.

The termination should be 95%

covered with new continuous solder

coating.

Solder temperature: 245±5°C

Test time: 3±0.5 seconds

(EIA-364-71)

Resistance to Soldering

Heat

No melting, cracks or functional

damage allowed.

When exposed to the following re-

flow soldering condition, there shell

be no any excessive thermal damage

on the every part of connector.

Reflow Profile

Preheating temperature: 150 ~ 200°C, 60~120 seconds

Liquidus temperature (TL): 217°C, 60~150 seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc): 255°C, 30seconds