RT5758 datasheet(21/26 Pages) RICHTEK

21 / 26 page

RT5758

DS5758-00 April 2018

www.richtek.com

is a registered trademark of Richtek Technology Corporation.

Figure 10. PCB Layout Guide (Top Layer)

Figure 11. PCB Layout Guide (Bottom Layer)

Layout Consideration

VIN

BOOT

PGND

VIN

AVCC

AGND

COUT1

COUT2

COUT3

COUT4

CIN1

CIN2

VOUT

CAVCC

VAVCC

RPGOOD

CSS

VOUT

REN

CBOOT

Place the feedback components

as close to the IC as possible.

PGND layout trace should be

wider for thermal consideration.

SW should be connected to inductor by

wide and short trace, and keep sensitive

components away from this trace.

AVCC capacitor must

be placed as close to

the IC as possible.

Input capacitor must be

placed as close to the IC

as possible.

Add via for thermal

consideration.

Keep sensitive components

away from CBOOT.

Power Good Indicator

Open-Drain Output.

The REN component

must be connected.

AGND must be connected

to clear ground.

PGND

Add via for thermal

consideration.

RT5758 Datasheet(PDF) 21 Page - Richtek Technology Corporation

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