SN65MLVD047 datasheet(3/17 Pages) TI

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RECOMMENDED OPERATING CONDITIONS (see Figure 1)

THERMAL CHARACTERISTICS

DEVICE ELECTRICAL CHARACTERISTICS

SN65MLVD047

SLLS606A – MARCH 2004 – REVISED JULY 2005

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.3

3.6

VIH

High-level input voltage

VCC

VIL

Low-level input voltage

0.8

Voltage at any bus terminal (separate or common mode) VY or VZ

–1.4

3.8

Differential load resistance

Ω

1/tUI

Signaling rate

200

Mbps

Clock frequency

100

MHz

Junction temperature

–40

125

°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-K board(1), no airflow

128

Low-K board(1), no airflow

194.2

Junction-to-ambient thermal resistance

Low-K board(1), 150 LFM

146.8

°C/W

Low-K board(1), 250 LFM

133.1

High-K board(2), no airflow

121.6

51.1

Junction-to-board thermal resistance

High-K board(2)

°C/W

85.3

45.4

Junction-to-case thermal resistance

°C/W

34.7

EN = VCC, EN = GND, RL = 50 Ω, Input 100 MHz 50 %

Device power dissipation

288.5

duty cycle square wave to 1A:4A, TA = 85°C

(1)

In accordance with the Low-K thermal metric difinitions of EIA/JESD51-3.

(2)

In accordance with the High-K thermal metric difinitions of EIA/JESD51-7.

over recommended operating conditions unless otherwise noted

PARAMETER

TEST CONDITIONS

MIN(1) TYP(2)

MAX

UNIT

Driver enabled

EN = VCC, EN = GND, RL = 50 Ω, All inputs = VCC or GND

ICC

Supply current

Driver disabled EN = GND, EN = VCC, RL = No load, All inputs = VCC or GND

(1)

The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

(2)

All typical values are at 25°C and with a 3.3-V supply voltage.

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