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CD54HC112 Datasheet(PDF) 4 Page - Texas Instruments

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Part # CD54HC112
Description  CDx4HC112, CDx4HCT112 Dual J-K Flip-Flop with Set and Reset with Negative-Edge Trigger
PDF  29 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CD54HC112 Datasheet(HTML) 4 Page - Texas Instruments

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5 Specifications
5.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input diode current
For VI < -0.5 V or VI > VCC + 0.5 V
± 20
mA
IO
Drain current, per output
For -0.5 V < VO < VCC + 0.5 V
± 25
mA
IOK
Output diode current
For VO < -0.5 V or VO > VCC + 0.5 V
± 20
mA
IO
Output source or sink current per output pin
For VO > -0.5 V or VO < VCC + 0.5 V
± 25
mA
ICC
Continuous current through VCC or GND
± 50
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature range
– 65
150
°C
Lead temperature (Soldering 10s)
300
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
Supply voltage range
HC types
2
6
V
HCT types
4.5
5.5
VI, VO
Input or output voltage
0
VCC
V
tr, tf
Input rise and fall time
2 V
1
ms
4.5 V
1
6 V
1
TA
Temperature range
–55
125
℃
5.3 Thermal Information
THERMAL METRIC
D (SOIC)
N (PDIP)
NS (SO)
PW (TSSOP)
UNIT
16 PINS
16 PINS
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal
resistance
(1)
117.2
69.3
88.4
137.5
°C/W
RθJC (top)
Junction-to-case (top) thermal
resistance
77.2
61.8
46
75.3
°C/W
RθJB
Junction-to-board thermal
resistance
75.6
49.3
50.6
82.2
°C/W
ΨJT
Junction-to-top characterization
parameter
38.1
34.6
13
25.1
°C/W
ΨJB
Junction-to-board characterization
parameter
75.3
49
50.2
81.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
N/A
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
SCHS141J – MARCH 1998 – REVISED OCTOBER 2022
www.ti.com
4
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: CD54HC112 CD74HC112 CD54HCT112 CD74HCT112



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