REV. G

–4–

AD829

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD829 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation

2

PDIP (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.9 W

CERDIP (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

Differential Input Voltage

3

. . . . . . . . . . . . . . . . . . . . . . .

±6 V

Output Short Circuit Duration . . . . . . . . . . . . . . . . . Indefinite

Storage Temperature Range (Q, E) . . . . . . . . –65

°C to +150°C

Storage Temperature Range (N, R) . . . . . . . . –65

°C to +125°C

Operating Temperature Range

AD829J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0

°C to 70°C

AD829A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

AD829S . . . . . . . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; the functional operation of

the device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

150

°C at an ambient temperature of 25°C.

Thermal characteristics:

8-lead PDIP package:

θ

°C/W (derate at 8.7 mW/°C)

8-lead CERDIP package:

θ

°C/W (derate at 8.7 mW/°C)

20-lead LCC package:

θ

°C/W

8-lead SOIC package:

θ

°C/W (derate at 6 mW/°C).

be added to limit the input current.

METALLIZATION PHOTO

Contact factory for latest dimensions.

Dimensions shown in inches and (mm).

2.5

2.0

1.5

1.0

0.5

0

–55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125

AMBIENT TEMPERATURE ( C)

LCC

CERDIP

SOIC

PDIP

Figure 1. Maximum Power Dissipation vs. Temperature