DRV8411 datasheet(42/53 Pages) TI

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EXAMPLE STENCIL DESIGN

16X (1.5)

16X (0.45)

14X (0.65)

(5.8)

(R0.05) TYP

(2.64)

BASED ON

0.125 THICK

STENCIL

(2.5)

BASED ON

0.125 THICK

STENCIL

PowerPAD TSSOP - 1.2 mm max height

PWP0016-C01

SMALL OUTLINE PACKAGE

4229315/A 12/2022

2.11 X 2.23

0.175

2.28 X 2.41

0.15

2.5 X 2.64 (SHOWN)

0.125

2.80 X 2.95

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

SYMM

METAL COVERED

BY SOLDER MASK

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

DRV8411A

SLVSGI9A – OCTOBER 2022 – REVISED JULY 2023

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