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BYV32 Datasheet(PDF) 2 Page - NXP Semiconductors |
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BYV32 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 6 page ![]() Philips Semiconductors Product specification Rectifier diodes BYV32 series ultrafast THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-mb Thermal resistance junction to per diode - - 2.4 K/W mounting base both diodes conducting - - 1.6 K/W R th j-a Thermal resistance junction to in free air - 60 - K/W ambient STATIC CHARACTERISTICS T j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage (per diode) I F = 8 A; Tj = 150˚C - 0.72 0.85 V I F = 20 A - 1.00 1.15 V I R Reverse current (per diode) V R = VRWM; Tj = 100 ˚C - 0.2 0.6 mA V R = VRWM - 6 30 µA DYNAMIC CHARACTERISTICS T j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Q s Reverse recovery charge (per I F = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs - 8 12.5 nC diode) t rr Reverse recovery time (per I F = 1 A; VR ≥ 30 V; - 20 25 ns diode) -dI F/dt = 100 A/µs I rrm Peak reverse recovery current I F = 1 A; VR ≥ 30 V; - 1.5 2 A (per diode) -dI F/dt = 50 A/µs; Tj = 100 ˚C V fr Forward recovery voltage (per I F = 1 A; dIF/dt = 10 A/µs - 1 - V diode) October 1994 2 Rev 1.100 |
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