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AM263P4 Datasheet(PDF) 82 Page - Texas Instruments

Part # AM263P4
Description  AM263Px Sitara™ Microcontrollers
PDF  154 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM263P4 Datasheet(HTML) 82 Page - Texas Instruments

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6.10 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 6.5, Recommended Operating Conditions.
6.10.1 Package Thermal Characteristics
It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.
PARAMETER
DESCRIPTION
℃/W(1) (2)
AIR FLOW (m/s)
(3)
RΘJC
Junction-to-case
5.4
N/A
RΘJB
Junction-to-board
5.4
N/A
RΘJA
Junction-to-free air
18.5
0
RΘJA
Junction-to-moving air
TBD
1
TBD
2
TBD
3
ΨJT
Junction-to-package top
0.1
0
TBD
1
TBD
2
TBD
3
ΨJB
Junction-to-board
5.3
0
TBD
1
TBD
2
TBD
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
℃/W = degrees Celsius per watt
(3)
m/s = meters per second
TI Information - Selective Disclosure
AM263P4, AM263P2, AM263P1, AM263P4-Q1, AM263P2-Q1, AM263P1-Q1
SPRSP81 – OCTOBER 2023
www.ti.com
82
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Copyright © 2023 Texas Instruments Incorporated



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