Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Product data

Rev. 06 — 30 November 2001

17 of 24

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Fig 13. TSSOP16 package outline.

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8

0

o

o

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1

MO-153

95-04-04

99-12-27

D

Z

e

0.25

18

16

9

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.10

pin 1 index