Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Product data

Rev. 06 — 30 November 2001

21 of 24

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

15. Additional soldering information

15.1 (H)BCC packages: footprint

The surface material of the terminals on the resin protrusion consists of a 4-layer

metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1

µm min.) ensures

solderability, the Ni layer (5

µm min.) prevents diffusion, and the Pd layer on top

(0.5

µm min.) ensures effective wire bonding.

15.2 (H)BCC packages: reflow soldering profile

The conditions for reflow soldering of (H)BCC packages are as follows:

°C

°C

Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.

Fig 15. (H)BCC footprint and solder resist mask dimensions.

004aaa123

b1

b

b2

Dh

0.05

All dimensions in mm

For exact dimensions

see package outline

drawing (SOT639-2)

Normal

Terminal

PCB land

Solder resist mask

Stencil mask

Solder land

Corner

0.05

b2

b2

b2

Eh

0.05

0.05

0.05

0.05

0.05

0.1

(4

×)

0.3 (8

×)

0.05

Solder resist

Solder stencil

b1

b

Stencil print thickness:

0.1 to 0.12 mm

Cavity

0.05

0.05

Dh

Eh