Spark Gap Protectors (SPG)

Revision March 1,2022

www.unsemi.com.tw

For technical questions, contact: tech@unsemi.com.tw

ROHS

Specifications are subject to change without notice.

Please refer to www.unsemi.com.tw for current information.

4/5

UNC Series

Recommended Soldering Conditions

Flow Soldering Conditions

Reflow Soldering Conditions

1) Time shown in the above figures is measured from the point when chip surface reaches temperature.

2) Temperature difference in high temperature part should be within 110℃ .

3) After soldering, do not force cool, allow the parts to cool gradually.

Solder iron temperature: 350±5℃

Heating time: 3 seconds max.

General attention to soldering



High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence

strength, and the change of characteristic may occur.



For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding

200℃ to fewer than 50 seconds.



Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to

remove any residue from the underside of components that could affect resistance.

Cleaning

When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause

cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below:

Frequency: 40kHz max.

Output power: 20W/liter

Cleaning time: 5 minutes max.

Hand Soldering

0

50

100

150

200

250

Air Preheat

Soldering

Cooling

0

50

100

150

200

250

Air Preheat

Soldering

Cooling

60~120sec

60sec. or less

60~120sec

3~4sec

150~180℃

150~180℃

260℃

260℃

△

T

△

T

10sec. or less