AM29LV640MH datasheet(59/62 Pages) AMD

59 / 62 page

December 14, 2005

Am29LV640MH/L

DA TA SH EET

PHYSICAL DIMENSIONS

TS056/TSR056—56-Pin Standard and Reverse Pinout

Thin Small Outline Package (TSOP)

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).

(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)

PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).

PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.

TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS

DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE

LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.

DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE

MOLD PROTUSION IS 0.15 mm PER SIDE.

DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE

DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b

DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN

PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.

THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN

0.10 mm AND 0.25 mm FROM THE LEAD TIP.

LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE

SEATING PLANE.

DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.

3160\38.10A

MO-142 (B) EC

TS/TSR 56

NOM.

---

1.00

1.20

0.15

1.05

MAX.

---

MIN.

0.95

0.20

0.23

0.17

0.22

0.27

0.17

---

0.16

0.10

---

0.21

0.10

20.00

20.20

19.90

14.00

14.10

13.90

0.60

0.70

0.50

3˚

5˚

0˚

---

0.20

0.08

18.40

18.50

18.30

0.05

0.50 BASIC

JEDEC

PACKAGE

SYMBOL

AM29LV640MH Datasheet(PDF) 59 Page - Advanced Micro Devices

AM29LV640MH Datasheet(HTML) 59 Page - Advanced Micro Devices

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