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NE591 Datasheet(PDF) 6 Page - NXP Semiconductors

Part # NE591
Description  Addressable peripheral drivers
PDF  9 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

NE591 Datasheet(HTML) 6 Page - NXP Semiconductors

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Philips Semiconductors Linear Products
Product specification
NE590/591
Addressable peripheral drivers
August 31, 1994
523
SWITCHING CHARACTERISTICS
VCC = 5V, TA = 25°C
SYMBOL
PARAMETER
TO
FROM
NE590
NE591
UNIT
SYMBOL
PARAMETER
TO
FROM
Min
Typ
Max
Min
Typ
Max
UNIT
Propagation delay time
tPLH
tPHL
Low-to-High1
High-to-Low1
Output
CE
65
115
150
230
50
70
80
120
ns
tPLH
tPHL
Low-to-High2
High-to-Low2
Output
Data
65
120
130
240
45
65
70
100
ns
tPLH
tPHL
Low-to-High3
High-to-Low3
Output
Address
100
130
200
260
45
75
80
140
ns
tPLH
tPHL
Low-to-High4
High-to-Low4
Output
CLR
65
130
45
140
ns
tPLH
tPHL
Low-to-High1
High-to-Low1
Output
CS
40
70
80
120
ns
Switching setup requirements
tS(H)
Chip enable
High data
210
100
ns
tS(L)
Chip enable
Low data
210
100
ns
tS(A)
Chip enable
Address
30
30
ns
tH(H)
Chip enable
High data
40
10
ns
tH(L)
Chip enable
Low data
30
10
ns
tS(CS)
Chip enable
Low chip select
100
ns
tPW(E)
Chip enable pulse width1
120
120
ns
NOTES:
1. See Turn-On and Turn-Off Delays, Enable to Output and Enable Pulse Width timing diagram.
2. See Turn-On and Turn-Off Delays, Data to Output timing diagram.
3. See Turn-On and Turn-Off Delays, Address to Output timing diagram.
4. See Turn-Off Delay, Clear to Output timing diagram.
5. See Setup and Hold Time, Data to Enable timing diagram.
6. See Setup Time, Address to Enable timing diagram.
FUNCTIONAL DESCRIPTION
These peripheral drivers have latched outputs which hold the input
data until cleared. The NE590 has active-Low, open-collector
outputs, while the NE591 has active-High, uncommitted (open)
emitter outputs. All outputs are cleared when power is first applied.
Addressable Latch Function
Any given output can be turned on or off by presenting the address
of the output to be set or cleared to the three address pins, by
holding the “D” input High to turn on the selected input, or by holding
it Low to turn off, holding the CLR input High, and bringing the CE
input Low. Once an output is turned on or off, it will remain so until
addressed again, or until all outputs are cleared by bringing the
CLR, CE, and “D” inputs Low. For NE591, CS must be brought Low
any time CE is Low if any outputs are to be changed.
Demultiplexer Operation
By bringing the CLR and CE inputs Low and the “D” input High, the
addressed output will remain on and all other outputs will be off. This
condition will remain only as long as the output is addressed. For the
NE591, the CS input must also be Low.
High Current Outputs
The obvious advantage of these devices over the 9334 and
N74LS259 (which provide a similar function) is the fact that the
NE590 and NE591 are capable of output currents of 250mA at each
of their eight outputs. It should be noted, however, that the load
power dissipation would be over 2.5W if all 8 outputs were to carry
their full rated load current at one time. Since the total power
dissipation is limited by the package to 1W, and since the power
dissipation due to supply current is 0.25W, the total load power
dissipation by the device is limited to 0.75W, and decreases as
ambient temperature rises.
The maximum die junction temperature must be limited to 165
°C,
and the temperature rise above ambient and the junction
temperature are defined as:
tR=θJA×P
tJ=tA+tR
where
θJA is die junction to ambient thermal resistance.
PD is total power dissipation
tR is junction temperature rise above ambient
tj is die junction temperature
tA is ambient (surrounding medium) temperature
For example, if we are using the NE590 in a plastic package in an
application where the ambient temperature is never expected to rise
above 50
°C, and the output current at the 8 outputs, when on, are
100, 40, 50, 200, 15, 30, 80, and 10mA, we find from the graph of
output voltage vs load current that the output voltages are expected
to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4V,
respectively. Total device power due to these loads is found to be
473.5mW. Adding the 250mW due to the power supply brings total
device power dissipation to 723.5mW. The thermal resistances are
83
°C per W for plastic packages and 100°C per W for Cerdips.
Using the equations above we find:



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