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NE591 Datasheet(PDF) 6 Page - NXP Semiconductors |
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NE591 Datasheet(HTML) 6 Page - NXP Semiconductors |
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6 / 9 page ![]() Philips Semiconductors Linear Products Product specification NE590/591 Addressable peripheral drivers August 31, 1994 523 SWITCHING CHARACTERISTICS VCC = 5V, TA = 25°C SYMBOL PARAMETER TO FROM NE590 NE591 UNIT SYMBOL PARAMETER TO FROM Min Typ Max Min Typ Max UNIT Propagation delay time tPLH tPHL Low-to-High1 High-to-Low1 Output CE 65 115 150 230 50 70 80 120 ns tPLH tPHL Low-to-High2 High-to-Low2 Output Data 65 120 130 240 45 65 70 100 ns tPLH tPHL Low-to-High3 High-to-Low3 Output Address 100 130 200 260 45 75 80 140 ns tPLH tPHL Low-to-High4 High-to-Low4 Output CLR 65 130 45 140 ns tPLH tPHL Low-to-High1 High-to-Low1 Output CS 40 70 80 120 ns Switching setup requirements tS(H) Chip enable High data 210 100 ns tS(L) Chip enable Low data 210 100 ns tS(A) Chip enable Address 30 30 ns tH(H) Chip enable High data 40 10 ns tH(L) Chip enable Low data 30 10 ns tS(CS) Chip enable Low chip select 100 ns tPW(E) Chip enable pulse width1 120 120 ns NOTES: 1. See Turn-On and Turn-Off Delays, Enable to Output and Enable Pulse Width timing diagram. 2. See Turn-On and Turn-Off Delays, Data to Output timing diagram. 3. See Turn-On and Turn-Off Delays, Address to Output timing diagram. 4. See Turn-Off Delay, Clear to Output timing diagram. 5. See Setup and Hold Time, Data to Enable timing diagram. 6. See Setup Time, Address to Enable timing diagram. FUNCTIONAL DESCRIPTION These peripheral drivers have latched outputs which hold the input data until cleared. The NE590 has active-Low, open-collector outputs, while the NE591 has active-High, uncommitted (open) emitter outputs. All outputs are cleared when power is first applied. Addressable Latch Function Any given output can be turned on or off by presenting the address of the output to be set or cleared to the three address pins, by holding the “D” input High to turn on the selected input, or by holding it Low to turn off, holding the CLR input High, and bringing the CE input Low. Once an output is turned on or off, it will remain so until addressed again, or until all outputs are cleared by bringing the CLR, CE, and “D” inputs Low. For NE591, CS must be brought Low any time CE is Low if any outputs are to be changed. Demultiplexer Operation By bringing the CLR and CE inputs Low and the “D” input High, the addressed output will remain on and all other outputs will be off. This condition will remain only as long as the output is addressed. For the NE591, the CS input must also be Low. High Current Outputs The obvious advantage of these devices over the 9334 and N74LS259 (which provide a similar function) is the fact that the NE590 and NE591 are capable of output currents of 250mA at each of their eight outputs. It should be noted, however, that the load power dissipation would be over 2.5W if all 8 outputs were to carry their full rated load current at one time. Since the total power dissipation is limited by the package to 1W, and since the power dissipation due to supply current is 0.25W, the total load power dissipation by the device is limited to 0.75W, and decreases as ambient temperature rises. The maximum die junction temperature must be limited to 165 °C, and the temperature rise above ambient and the junction temperature are defined as: tR=θJA×P tJ=tA+tR where θJA is die junction to ambient thermal resistance. PD is total power dissipation tR is junction temperature rise above ambient tj is die junction temperature tA is ambient (surrounding medium) temperature For example, if we are using the NE590 in a plastic package in an application where the ambient temperature is never expected to rise above 50 °C, and the output current at the 8 outputs, when on, are 100, 40, 50, 200, 15, 30, 80, and 10mA, we find from the graph of output voltage vs load current that the output voltages are expected to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4V, respectively. Total device power due to these loads is found to be 473.5mW. Adding the 250mW due to the power supply brings total device power dissipation to 723.5mW. The thermal resistances are 83 °C per W for plastic packages and 100°C per W for Cerdips. Using the equations above we find: |
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