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NE591 Datasheet(PDF) 7 Page - NXP Semiconductors |
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NE591 Datasheet(HTML) 7 Page - NXP Semiconductors |
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7 / 9 page ![]() Philips Semiconductors Linear Products Product specification NE590/591 Addressable peripheral drivers August 31, 1994 524 Plastic tR=83×0.7235=60°C Plastic tJ=50+60=100°C Cerdip tR=100×0.7235=72.40°C Cerdip tJ=50+72.4=122.4°C Thus we find that tJ for either package is below the 165°C maximum and either package could be used in this application. The graphs of total load power vs ambient temperature would also give us this same information, although interpreting the graphs would not yield the same accuracy. TYPICAL PERFORMANCE CHARACTERISTICS N PACKAGE F PACKAGE 0 25 50 75 100 125 1.0 0.75 0.50 0.25 TEMPERATURE (oC) Output Voltage vs Load Current (NE590) Output Voltage Drop vs Load Current (NE591) Total Load Power vs Temperature (NE590) Total Load Power vs Temperature (NE591) 1.2 1.0 0.8 0.6 0.4 0 50 100 150 200 70 C 25 C 0 C N PACKAGE F PACKAGE 0 25 50 75 100 125 1.0 0.75 0.50 0.25 OUTPUT LOAD CURRENT (mA) TEMPERATURE (oC) 2.0 1.8 1.6 0 50 100 150 200 70 C 25 C 0 C OUTPUT LOAD CURRENT (mA) 1.0 1.2 1.4 250 |
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