ADS5545 datasheet(2/57 Pages) TI

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SHA

12-Bit

ADC

CLOCKGEN

Reference

Digital

Encoder

and

Serializer

Control

Interface

INP

INM

CLKP

CLKM

VCM

CLKOUTP

CLKOUTM

D0_D1_P

D0_D1_M

D2_D3_P

D4_D5_P

D6_D7_P

D8_D9_P

D10_D11_P

D2_D3_M

D4_D5_M

D6_D7_M

D8_D9_M

D10_D11_M

OVR

LVDSMODE

ADS5527

SLWS196A – DECEMBER 2006 – REVISED MAY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION(1)

SPECIFIED

TRANSPORT

PACKAGE-

PACKAGE

ORDERING

PRODUCT

TEMPERATURE

MEDIA,

LEAD

DESIGNATOR

MARKING

NUMBER

RANGE

QUANTITY

Tape and Reel,

ADS5527IRGZT

250

ADS5527

QFN-48(2)

RGZ

–40

°C to 85°C

AZ5527

Tape and Reel,

ADS5527IRGZR

2500

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

For thermal pad size on the package, see the mechanical drawings at the end of this data sheet.

JA = 25.41°C/W (0 LFM air flow),

JC = 16.5°C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in x 3 in (7.62 cm x 7.62

cm) PCB.

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