Data Sheet

ADR1001

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. 0 | 7 of 21

Table 5. Absolute Maximum Ratings

Parameter

Rating

SUPPLY VOLTAGES

HTR_IN to HTR_GND (Substrate)1

8 V to 36 V

VIN to HTR_GND (Substrate)1

36 V

VIN to REF_GND

36 V

REF_GND to BUF_GND

−0.3 V to +0.3 V

PRECISION RESISTOR-DIVIDERS

VDIN to REF_GND

12 V

VDOUT to REF_GND

8 V

VDOUT to VDIN

4 V

TSET

(REF_GND − 0.3 V) to

(REF6P6_F + 0.3 V)

INV2 to INV1

−0.3 V to +8 V

OUTPUT BUFFER2

BUF_INP to BUF_S Maximum Differential

15 V

BUF_INP and BUF_S Maximum Input

Current

5 mA

BUF_F to INV2

−0.3 V to +8 V

PWRGD to REF_GND

36 V

TEMPERATURE

Storage Range

−65°C to +150°C

Operating Range

−40°C to +130°C

Junction Range

−40°C to +130°C

Lead, Soldering (10 sec)

300°C

LATCHUP

100 mA

1 HTR_GND must be the lowest potential on the chip to prevent the forward bias

of the substrate junction.

2 BUF_F cannot go below REF_GND (inverting function). If a negative reference

is desired, see Figure 47.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Close attention to PCB thermal design is required.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

E-20-1

2-Layer JEDEC Board

120

N/A

°C/W

Evaluation Board

140

N/A

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for the ADR1001

Table 7. ADR1001, 20-Terminal LCC

ESD Model

Withstand Threshold (V)

Class

HBM

±2000

2

FICDM

±1000

C3

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.