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ADC3683 Datasheet(PDF) 67 Page - Texas Instruments |
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ADC3683 Datasheet(HTML) 67 Page - Texas Instruments |
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67 / 70 page ![]() 12.1 Mechanical Data www.ti.com PACKAGE OUTLINE ( 8) HEAT SINK 64X 0.27 0.17 10.16 0.08 4X 7.5 0.13 60X 0.5 0.05 3.53 MAX 8 0.13 HEAT SINK 1.5 0.1 64X 0.15 0.05 (0.1) TYP 1.45 0.15 11.03 10.77 (0.3) 4X 9.5 0.13 4X (3.43) 29.36 0.38 64X 0.5 MAX 0.76 0.13 29.36 0.38 (0.417) TYP 4X (R0.75) 4X (1.78) 4X (1.1) 8X (R0.55) CFP - 3.53 mm max height HBP0064A CERAMIC FLATPACK 4228542/A 03/2022 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermetically sealed with a metal lid. 4. Ground pad to be electronic connected to heat sink and seal ring. 5. The leads are gold plated and can be solder dipped. 1 49 64 48 33 17 16 32 4X (45 X 0.3) SEAL RING 4X ( 0.38) SYMM SCALE 0.800 SYMM PIN 1 ID 49 48 1 64 33 17 16 32 BOTTOM VIEW www.ti.com ADC3683-SP SBASAB5 – MARCH 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 67 Product Folder Links: ADC3683-SP |
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