TSL2584TSVM datasheet(28/34 Pages) OSRAM

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ams Datasheet

Page 27

[v1-08] 2017-Aug-28

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TSL2584TSV − Soldering & Storage Information

Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

Devices are dry packed in a sealed aluminized envelope called

a moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Floor Life

This package has been assigned a moisture sensitivity level of

MSL 1. As a result, the floor life of the devices removed from the

moisture barrier bag is unlimited from the time the bag was

opened, provided that the devices are stored under the

following conditions:

• Floor Life: Unlimited

• Ambient Temperature: < 30°C

• Relative Humidity: < 85%

If the floor life or the temperature/humidity conditions have

been exceeded, the devices must be rebaked prior to solder

reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded,

rebake at 50°C for 12 hours.

TSL2584TSVM Datasheet(PDF) 28 Page - OSRAM GmbH