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33889 Datasheet(PDF) 57 Page - Freescale Semiconductor, Inc |
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33889 Datasheet(HTML) 57 Page - Freescale Semiconductor, Inc |
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57 / 60 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 57 33889 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Figure 24. Thermal Test Board Device on Thermal Test Board RθJA is the thermal resistance between die junction and ambient air. 28-Pin SOICW 1.27 mm Pitch 18.0 mm x 7.5 mm Body 33889 Pin Connections WDOG MISO SCLK GND GND GND GND CANL CANH RTL RTH V2 CS MOSI RX RST INT GND GND GND GND V2CTRL VSUP HS1 L0 L1 TX VDD1 4 5 6 7 8 9 10 11 12 13 14 2 3 28 25 24 23 22 21 20 19 18 17 16 15 27 26 1 A Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Outline: 80 mm x 100 mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 35. Thermal Resistance Performance Thermal Resistance Area A (mm2) ( °C/W) RθJA 0 69 300 53 600 48 |
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