ADPA9007-2 datasheet(27/28 Pages) AD

27 / 28 page

Data Sheet

ADPA9007-2

MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE, GAAS, MMICS

analog.com

Rev. 0 | 27 of 28

Attach the die directly to the ground plane with high thermal con-

ductive epoxy (see the Handling Precautions section, the Mounting

section, and the Wire Bonding section).

Place the microstrip substrates as close to the die as possible to

minimize wire bond length. Typical die to substrate spacing is 0.076

mm to 0.152 mm (3 mil to 6 mil).

Figure 86. Input Wire Bonding and Substrate Spacing

Figure 87. Output Wire Bonding and Substrate Spacing

Handling Precautions

To avoid permanent damage, follow these storage, cleanliness,

static sensitivity, transient, and general handling precautions:

►

Place all bare die in either waffle- or gel-based ESD protective

containers and then seal the die in an ESD protective bag for

shipment. After the sealed ESD protective bag is opened, store

all dies in a dry nitrogen environment.

►

Handle the chips in a clean environment. Do not attempt to clean

the chip using liquid cleaning systems.

►

Follow ESD precautions to protect against ESD strikes.

►

While bias is applied, suppress instrument and bias supply tran-

sients. Use shielded signal and bias cables to minimize inductive

pickup.

►

Handle the chip along the edges with a vacuum collet or with

a sharp pair of tweezers. The surface of the chip has fragile air

bridges and must not be touched with a vacuum collet, tweezers,

or fingers.

Mounting

Before the die is attached, apply enough epoxy to the mounting

surface so that a thin epoxy fillet is observed around the perimeter

of the chip after it is placed into position. Cure the epoxy per the

schedule of the manufacturer.

Wire Bonding

RF bonds made with 1 mil gold wire are recommended for the RF

ports. These bonds must be thermosonically bonded with a force

of 40 g to 60 g. Thermosonically bonded DC bonds of 0.025 mm

diameter (0.001 in) are recommended. Create ball bonds with a

force of 40 g to 50 g and wedge bonds with a force of 18 g to

22 g. Create all bonds with a nominal stage temperature of 150°C.

Apply the minimum amount of ultrasonic energy (depending on the

process and package being used) to achieve reliable bonds. Keep

all bonds as short as possible, less than 0.31 mm (12 mil).

ADPA9007-2 Datasheet(PDF) 27 Page - Analog Devices

ADPA9007-2 Datasheet(HTML) 27 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

Datasheet Download

Link URL