Benefits

S

G 1

2

D

3

Application(s)

• System/Load Switch

Symbol

Parameter

Units

VDS

Drain-Source Voltage

V

ID @ TA = 25°C

Continuous Drain Current, VGS @ 10V

ID @ TA = 70°C

Continuous Drain Current, VGS @ 10V

IDM

Pulsed Drain Current

PD @TA = 25°C

Maximum Power Dissipation

PD @TA = 70°C

Maximum Power Dissipation

Linear Derating Factor

W/°C

VGS

Gate-to-Source Voltage

V

TJ, TSTG

Junction and Storage Temperature Range

°C

Thermal Resistance

Symbol

Parameter

Typ.

Max.

Units

RθJA

Junction-to-Ambient

e

RθJA

Junction-to-Ambient (t<10s)

f

°C/W

A

Max.

-3.6

-2.9

-55 to + 150

± 20

0.01

-30

1.3

0.8

-15

W

Lower switching losses

Multi-vendor compatibility

Easier manufacturing

Environmentally friendly

Increased reliability

Notes:

 Repetitive rating; pulse width limited by max. junction temperature.

‚ Pulse width ≤ 400μs; duty cycle ≤ 2%.

ƒ Surface mounted on 1 in square Cu board

IRLML9301

FEATURES

VDS (V) = -30V

RDS(ON)

64m

(V GS = -10V)

RDS(ON)

103m

(V GS = -4.5V)

P−CHANNEL MOSFET

SOT–23

1. GATE

2. SOURCE

3. DRAIN

Rev:2023A2

1

100

99