Philips Semiconductors

Product specification

SA5224

FDDI fiber optic postamplifier

1998 Oct 07

7

Since Philips Semiconductors has no control of third party

procedures in the handling or packaging of die, Philips

Semiconductors assumes no liability for device functionality or

performance of the die or systems on any die sales.

Although Philips Semiconductors typically realizes a yield of 85%

after assembling die into their respective packages, with care

customers should achieve a similar yield. However, for the reasons

stated above, Philips Semiconductors cannot guarantee this or any

other yield on any die sales.

1

2

3

4

5

6

7

89

10

11

12

13

14

15

16

CAZN

CAZP

GNDA

DIN

DIN

VCCA

CF

JAM

ST

ST

GNDE

DOUT

VCCE

VREF

DOUT

VSET

ECN No.: 01673

1991 Feb 8

SD00492

Figure 8. SA5224 Bonding Diagram