5.4 Thermal Information

PACKAGE

PINS

THERMAL METRIC(1)

UNIT

RθJA

RθJC(top)

RθJB

ΨJT

ΨJB

RθJC(bot)

PW (TSSOP)

16

141.8

74

87.1

22.3

86.6

-

°C/W

BQB (WQFN)

16

98.8

94.3

67.6

15.4

67.6

46.2

°C/W

DYY (SOT-23-THN)

16

196.3

117.4

122.9

22.3

122.7

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

-40°C to 125°C

UNIT

MIN

TYP

MAX

VOH

IOH= –100μA

1.1V to 3.6V

VCC - 0.2 VCC - 0.01

V

VOH

IOH= –4mA

1.65V

1.2

V

VOH

IOH= –8mA

2.3V

1.75

V

VOH

IOH= –12mA

2.7V

2.2

V

VOH

3V

2.4

V

VOH

IOH= –24mA

3V

2.2

V

VOL

IOL = 100μA

1.1V to 3.6V

0.01

0.2

V

VOL

IOL = 4mA

1.65V

0.45

V

VOL

IOL = 8mA

2.3V

0.7

V

VOL

IOL = 12mA

2.7V

0.4

V

VOL

IOL = 24mA

3V

0.55

V

II

VI = VCC or GND

3.6V

±5

µA

Ioff

VI or VO = VCC

0V

±10

µA

ICC

VI = VCC or GND, IO = 0

3.6V

40

µA

ΔICC

One input at VCC - 0.6V, other inputs at VCC or

GND

2.7V to 3.6V

5000

µA

CI

VI = VCC or GND

3.3V

4.9

pF

CO

VO = VCC or GND

3.3V

6.3

pF

CPD

f = 10MHz

1.8V

12

pF

CPD

f = 10MHz

2.5V

15

pF

CPD

f = 10MHz

3.3V

17

pF

5.6 Timing Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

DESCRIPTION

CONDITION

VCC

-40°C to 125°C

UNIT

MIN

MAX

Fclock

Clock frequency

1.2 V ± 0.1 V

59

MHz

1.5 V ± 0.15 V

64

MHz

1.8 V ± 0.15 V

64

MHz

2.5 V ± 0.2 V

100

MHz

3.3 V ± 0.3 V

104

MHz

tW

Pulse duration

CLR low

1.2 V ± 0.1 V

6.9

ns

tW

Pulse duration

SH/LD low

1.2 V ± 0.1 V

6.9

ns

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SN74LVC166A

SCLSA15 – MAY 2024

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