LTM2886 datasheet(16/18 Pages) AD

16 / 18 page

LTM2894

Rev A

For more information www.analog.com

PACKAGE TOP VIEW

PIN “A1”

CORNER

aaa Z

BGA Package

24-Lead (22mm

× 6.25mm × 2.06mm)

(Reference LTC DWG# 05-08-1991 Rev Ø)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

BALL DESIGNATION PER JESD MS-028 AND JEP95

DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

DETAIL A

Øb (24 PLACES)

DETAIL B

SUBSTRATE

ccc Z

DETAIL B

PACKAGE SIDE VIEW

MOLD

CAP

X Y

ddd

M Z

eee

SYMBOL

aaa

bbb

ccc

ddd

eee

MIN

1.81

0.40

1.41

0.55

0.45

0.46

0.95

NOM

2.06

0.50

1.56

0.60

0.50

22.0

6.25

1.0

20.75

5.0

0.56

1.00

MAX

2.31

0.60

1.71

0.65

0.55

0.66

1.05

0.15

0.10

0.15

0.08

NOTES

DIMENSIONS

TOTAL NUMBER OF BALLS: 24

SUGGESTED PCB LAYOUT

TOP VIEW

0.00

9.375

10.375

9.375

10.075

10.675

5. PRIMARY DATUM -Z- IS SEATING PLANE

6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu

0.60 ±0.025 Ø 24x

BGA 24 1014 REV Ø

TRAY PIN 1

BEVEL

PACKAGE IN TRAY LOADING ORIENTATION

COMPONENT

PIN “A1”

LTMXXXXXX

µModule

PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE

LAYOUT CAREFULLY

PACKAGE BOTTOM VIEW

DETAIL A

SEE NOTES

PIN 1

SEE NOTES

PACKAGE DESCRIPTION

LTM2886 Datasheet(PDF) 16 Page - Analog Devices

LTM2886 Datasheet(HTML) 16 Page - Analog Devices

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