XLAMP® XFL LED

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CLD-DS347

REV 1

2

CHARACTERISTICS

Characteristics

Unit

Minimum

Typical

Maximum

Thermal resistance, junction to solder point‑ XFL05K

°C/W

0.2

Thermal resistance, junction to solder point ‑ XFL08K

°C/W

0.1

Thermal resistance, junction to solder point ‑ XFL10K

°C/W

0.1

Viewing angle (FWHM) ‑ XFL05K

degrees

140

Viewing angle (FWHM) ‑ XFL08K

degrees

150

Viewing angle (FWHM) ‑ XFL10K

degrees

150

Temperature coefficient of voltage ‑ XFL05K

mV/°C

‑2.6

Temperature coefficient of voltage ‑ XFL08K

mV/°C

‑2.8

Temperature coefficient of voltage ‑ XFL10K

mV/°C

‑2.9

Reverse voltage

V

5

Forward current ‑ XFL05K*

A

15

Forward current ‑ XFL08K*

A

27

Forward current ‑ XFL10K*

A

32

Forward voltage (@ 1750 mA, 25 °C) ‑ XFL05K

V

5.6

6.1

Forward voltage (@ 3150 mA, 25 °C) ‑ XFL08K

V

5.7

6.1

Forward voltage (@ 4200 mA, 25 °C) ‑ XFL10K

V

5.7

6.1

LED junction temperature

°C

25

150

Note

• Thermal resistance measurement was performed per the JEDEC JESD51‑14 standard. See the Thermal Resistance Measurement

application note for more details.

* Refer to the Maximum Current vs. Junction Point Temperature section.