I•CODE1 Chip Specification

Rev. 2.1

May 2000

SL040521.doc/M

Public

Page 5 of 22

3 Scope

This specification describes the electrical, physical and dimensional properties of unsawn and sawn

wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery

of tested I•CODE1 Label ICs.

General recommendations are given for storage, handling and processing of wafers as well as

assembly of labels.

Reference documents:

MIL-STD 883D Method 3023

MIL-STD 883D Method 3015

SNW-FQ-627

PICTOH-QS007

General Specification for 6” Wafer (Prod. Spec.)

General Quality Specification

I•CODE1 Label IC, Coil Design Guide

This product specification is valid for VCOL1V0 from mask revision P/B upwards.

4 Ordering Information

Following ordering options are available:

Type Name

Description

Ordering Code

SL1 ICS30 01W/N5D

Sawn wafer on foil (FFC), 150 µm, inked and mapped

9352 644 66005

SL1 ICS30 01U/N5D

Unsawn wafer, 150 µm, inked and mapped

9352 644 65025

SL1 ICS30 01U/L6D

Unsawn wafer, 525 µm, mapped (not inked)

9352 644 64025