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AD5676 Datasheet(PDF) 30 Page - Analog Devices |
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AD5676 Datasheet(HTML) 30 Page - Analog Devices |
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30 / 31 page ![]() AD5673R/AD5677R Data Sheet Rev. 0 | Page 30 of 31 APPLICATIONS INFORMATION POWER SUPPLY RECOMMENDATIONS The AD5673R/AD5677R are typically powered by the following supplies: VDD = 3.3 V and VLOGIC = 1.8 V. The ADP7118 can be used to power the VDD pin. The ADP160 can be used to power the VLOGIC pin. Figure 66 shows this setup. The ADP7118 can operate from input voltages up to 20 V. The ADP160 can operate from input voltages up to 5.5 V. ADP160 LDO ADP7118 LDO 5V INPUT 1.8V: VLOGIC 3.3V: VDD Figure 66. Low Noise Power Solution for the AD5673R/AD5677R MICROPROCESSOR INTERFACING Microprocessor interfacing to the AD5673R/AD5677R uses a serial bus with a standard protocol that is compatible with DSP processors and microcontrollers. The communications channel requires a 2-wire interface consisting of a clock signal and a data signal. AD5673R/AD5677R TO ADSP-BF531 INTERFACE The I2C interface of the AD5673R/AD5677R is designed for easy connection to industry-standard DSPs and microcontrollers. Figure 67 shows the AD5673R/AD5677R connected to the Analog Devices, Inc., ADSP-BF531 Blackfin® processor. The Blackfin processor has an integrated I2C port that can be connected directly to the I2C pins of the AD5673R/AD5677R. ADSP-BF531 SCL GPIO1 LDAC PF9 RESET PF8 SDA GPIO2 AD5673R/ AD5677R Figure 67. AD5673R/AD5677R to ADSP-BF531 Interface LAYOUT GUIDELINES In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. Design the PCB on which the AD5673R or AD5677R is mounted so that the device lies on the analog plane. The AD5673R/AD5677R must have ample supply bypassing of 10 µF in parallel with 0.1 µF on each supply, located as close to the package as possible, ideally right up against the device. The 10 µF capacitors are tantalum bead type. The 0.1 µF capacitor must have low effective series resistance (ESR) and low effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. In systems where there are many devices on one board, it is often useful to provide some heat sinking capability to allow the power to dissipate easily. The GND plane on the device can be increased (as shown in Figure 68) to provide a natural heat sinking effect. GND PLANE BOARD Figure 68. Pad Connection to Board GALVANICALLY ISOLATED INTERFACE In many process control applications, it is necessary to provide an isolation barrier between the controller and the unit being controlled to protect and isolate the controlling circuitry from any hazardous common-mode voltages that may occur. iCoupler® products from Analog Devices provide voltage isolation in excess of 2.5 kV. The serial loading structure of the AD5673R/AD5677R makes the devices ideal for isolated interfaces because the number of interface lines is kept to a minimum. Figure 69 shows a 2-channel isolated interface to the AD5673R/AD5677R using an ADuM1251. For further information, visit www.analog.com/icoupler. DECODE SDA CONTROLLER ADuM12511 SCL 1ADDITIONAL PINS OMITTED FOR CLARITY. ENCODE TO SCL TO SDA ENCODE DECODE ENCODE DECODE Figure 69. Isolated Interface |
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