AD5116 datasheet(11/28 Pages) AD

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Data Sheet

AD5110/AD5112/AD5114

ABSOLUTE MAXIMUM RATINGS

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Rev. D | 11 of 28

TA = 25°C, unless otherwise noted.

Table 6.

Parameter

Rating

VDD to GND

–0.3 V to +7.0 V

VLOGIC to GND

–0.3 V to +7.0 V

VA, VW, VB to GND

GND − 0.3 V to VDD + 0.3 V

IA, IW, IB

Pulsed1

Frequency > 10 kHz

RAW = 5 kΩ and 10 kΩ2

±6 mA/d

RAW = 80 kΩ2

±1.5 mA/d

Frequency ≤ 10 kHz

RAW = 5 kΩ and 10 kΩ2

±6 mA/√d

RAW = 80 kΩ2

±1.5 mA/√d

Continuous

RAW = 5 kΩ and 10 kΩ

±6 mA

RAW = 80 kΩ

±1.5 mA

Digital Inputs SDA and SCL

−0.3 V to +7 V or VLOGIC + 0.3 V

(whichever is less)

Operating Temperature Range3

−40°C to +125°C

Maximum Junction Temperature (TJ Max)

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

(TJ max − TA)/θJA

1 Maximum terminal current is bounded by the maximum current handling of the

switches, maximum power dissipation of the package, and maximum applied

voltage across any two of the A, B, and W terminals at a given resistance.

2 d is the pulse duty factor.

3 Includes programming of EEPROM memory.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

θJA is defined by JEDEC specification JESD-51, and the value is

dependent on the test board and test environment.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead LFCSP

901

°C/W

1 JEDEC 2S2P test board, still air (0 m/sec air flow).

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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