SCA3000 Assembly Instructions

Figure 9. Solder pads, component leads and the solder joints are located under the component

itself.

X-ray inspection is a recommended inspection method for being able to check the complete solder

joint area for solder bridges or short-circuits between solder pads. The X-ray inspection systems

vary from manual to fully automated optical inspection systems. X-ray can be used for sample

based process control, but it can also be implemented as an automatic in-line control. X-ray

inspection can also be used to establish and optimize the component assembly process

parameters.

Cross-sectional analysis is also an approved method to inspect how well solder has wetted the

pads of component. Cross-sectional analysis is not used for production inspection, but if required, it

can be used to establish and optimize the component assembly process parameters. Cross-

sectioning is a destructive inspection method. An example of a SCA3000 solder joint cross-section

in presented in figure 10.

Figure 10. Wetting of solder is different on the inner and outer surface of the solder pad.

Outer

surface of

solder pad

Inner surface

of solder pad

VTI Technologies Oy

Subject to changes

11/15

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