AD8368 datasheet(19/20 Pages) AD

19 / 20 page

Data Sheet

AD8368

Rev. C | Page 19 of 20

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

EXPOSED

PAD

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.20 REF

0.25 MIN

3.16 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.65

2.50 SQ

2.45

0.05 MAX

0.02 NOM

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 45. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

Ordering

Quantity

AD8368ACPZ-REEL7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package (LFCSP)

CP-24-7

1,500

AD8368ACPZ-WP

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package (LFCSP)

CP-24-7

AD8368-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

WP = Waffle Pack.

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