LT6004 datasheet(29/32 Pages) AD

29 / 32 page

LTC2063/LTC2064/LTC2065

Rev. C

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PACKAGE DESCRIPTION

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.60 ±0.05

(4 SIDES)

2.10 ±0.05

3.50 ±0.05

0.70 ±0.05

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. NiPdAu PPF TERMINAL FINISH

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

1.60 ±0.10

(4-SIDES)

0.75 ±0.05

R = 0.115

TYP

0.25 ±0.05

PIN 1 NOTCH R = 0.20 TYP

OR 0.25 × 45° CHAMFER

15 16

0.50 BSC

0.200 REF

0.00 – 0.05

(UD16 VAR BB) QFN 0119 REV Ø

UD Package

16-Lead Plastic QFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1782 Rev Ø)

Exposed Pad Variation BB

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