LT2178 datasheet(17/26 Pages) AD

17 / 26 page

LTC6255/LTC6256/LTC6257

Rev E

For more information www.analog.com

PACKAGE DESCRIPTION

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

BOTTOM VIEW—EXPOSED PAD

0.55 ±0.05

0.125 REF

0.00 – 0.05

2.00 ±0.10

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.40 ±0.10

0.64 ±0.10

R = 0.115

TYP

R = 0.05

TYP

1.35 REF

1.37 ±0.10

(KC8) UTDFN 0107 REVØ

0.23 ±0.05

0.45 BSC

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

0.25 ±0.05

1.35 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64 ±0.05

1.37 ±0.05

1.15 ±0.05

0.70 ±0.05

2.55 ±0.05

PACKAGE

OUTLINE

0.45 BSC

KC Package

8-Lead Plastic UTDFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1749 Rev Ø)

OBSOLETE PACKAGE

LT2178 Datasheet(PDF) 17 Page - Analog Devices

LT2178 Datasheet(HTML) 17 Page - Analog Devices

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