9.2 Documentation Support

9.2.1 Related Documentation

The following documents are relevant to using the TLVx365-Q1, and recommended for reference. All are

available for download at www.ti.com unless otherwise noted.

• Texas Instruments, FilterPro™ software user's guide

• Texas Instruments, Low Power Input and Reference Driver Circuit for ADS8318 and ADS8319 application

report

• Texas Instruments, Op Amp Performance Analysis application bulletin

• Texas Instruments, Single-Supply Operation of Operational Amplifiers application bulletin

• Texas Instruments, The Best of Baker's Best – Amplifiers eBook reference book

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

TINA-TI™, FilterPro™, and TI E2E™ are trademarks of Texas Instruments.

TINA™ is a trademark of DesignSoft, Inc.

PSpice® is a registered trademark of Cadence Design Systems, Inc.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (December 2023) to Revision B (September 2024)

Page

• Changed TLV2365-Q1 device status from preview to advanced information (preview with samples)............... 1

• Added TLV2365-Q1 advanced information DGK package................................................................................. 1

• Added Thermal Information for DGK package................................................................................................... 4

Changes from Revision * (June 2023) to Revision A (December 2023)

Page

• Changed data sheet status from advanced mix to production mix.....................................................................1

TLV365-Q1, TLV2365-Q1

SBOSAB8B – JUNE 2023 – REVISED SEPTEMBER 2024

www.ti.com

20

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Product Folder Links: TLV365-Q1 TLV2365-Q1