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TLV365 Datasheet(PDF) 23 Page - Texas Instruments |
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TLV365 Datasheet(HTML) 23 Page - Texas Instruments |
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23 / 35 page ![]() www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max height D0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE:8X SYMM 1 4 5 8 SEE DETAILS SYMM www.ti.com TLV365-Q1, TLV2365-Q1 SBOSAB8B – JUNE 2023 – REVISED SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TLV365-Q1 TLV2365-Q1 |
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