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STAC9271 Datasheet(PDF) 220 Page - Integrated Device Technology |
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STAC9271 Datasheet(HTML) 220 Page - Integrated Device Technology |
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220 / 223 page ![]() STAC9271/9272/9273/9274 10-CHANNEL HIGH DEFINITION AUDIO CODEC PC AUDIO IDT™ 10-CHANNEL HIGH DEFINITION AUDIO CODEC 220 STAC9271/9272/9273/9274 V 1.0 MARCH2007 IDT CONFIDENTIAL 10. SOLDER REFLOW PROFILE 10.1. Standard Reflow Profile Data Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds. FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices” (www.jedec.org/download). Figure 6. Reflow Profile Profile Feature Pb Free Assembly Average Ramp-Up Rate (Tsmax - Tp) 3 oC / second max Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin - tsmax) 150 oC 200 oC 60 - 180 seconds Time maintained above Temperature (TL) Time (tL) 217 oC 60 - 150 seconds Peak / Classification Temperature (Tp) See “Package Classification Reflow Temperatures” on page 221. Time within 5 oC of actual Peak Temperature (tp) 20 - 40 seconds Ramp-Down rate 6 oC / second max Time 25 oC to Peak Temperature 8 minutes max Note: All temperatures refer to topside of the package, measured on the package body surface. |
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