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STAC9271 Datasheet(PDF) 220 Page - Integrated Device Technology

Part # STAC9271
Description  10-CHANNEL HIGH DEFINITION AUDIO CODEC
PDF  223 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

STAC9271 Datasheet(HTML) 220 Page - Integrated Device Technology

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STAC9271/9272/9273/9274
10-CHANNEL HIGH DEFINITION AUDIO CODEC
PC AUDIO
IDT™
10-CHANNEL HIGH DEFINITION AUDIO CODEC
220
STAC9271/9272/9273/9274 V 1.0 MARCH2007
IDT CONFIDENTIAL
10. SOLDER REFLOW PROFILE
10.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Figure 6. Reflow Profile
Profile Feature
Pb Free Assembly
Average Ramp-Up Rate (Tsmax - Tp)
3 oC / second max
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin - tsmax)
150 oC
200 oC
60 - 180 seconds
Time maintained above
Temperature (TL)
Time (tL)
217 oC
60 - 150 seconds
Peak / Classification Temperature (Tp)
See “Package Classification Reflow Temperatures”
on page 221.
Time within 5 oC of actual Peak Temperature (tp)
20 - 40 seconds
Ramp-Down rate
6 oC / second max
Time 25 oC to Peak Temperature
8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface.



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