PCA9674ATS datasheet(30/34 Pages) PHILIPS

30 / 34 page

PCA9674_PCA9674A_2

Product data sheet

Rev. 02 — 12 October 2006

30 of 34

NXP Semiconductors

PCA9674/74A

Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt

16.3.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45

° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

°C

or 265

°C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

16.3.3 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270

°C and 320 °C.

16.4 Package related soldering information

Table 12.

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting

Package[1]

Soldering method

Wave

Reﬂow[2]

Dipping

Through-hole mount

CPGA, HCPGA

suitable

−−

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable[3]

−

suitable

Through-hole-surface

mount

PMFP[4]

not suitable

−

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