 2015-2019 Microchip Technology Inc.

DS20005412B-page 21

HV7351

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Dimension Limits

Units

D

Overall Width

Overall Length

Exposed Pad Length

Exposed Pad Width

Terminal Thickness

D2

E2

E

9.70

MILLIMETERS

0.203 REF

MIN

(A3)

MAX

11.00 BSC

Terminal Length

Terminal Width

L

b

0.50

0.30

Notes:

1.

K

Terminal-to-Exposed Pad

0.20

NOM

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

3.

2.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Standoff

A1

-

Overall Height

A

0.85

Pitch

e

0.50 BSC

Number of Terminals

N80

0.30

0.18

9.50

0.00

0.80

0.25

0.40

-

9.60

11.00 BSC

0.05

0.90

-

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M.

Package is saw singulated.

Microchip Technology Drawing C04-301A-8FX Sheet 2 of 2

80-Lead Plastic Quad Flat, No Lead Package (8FX) – 11x11x0.9 mm Body [VQFN]

9.70

9.50

9.60