TIL311

HEXADECIMAL DISPLAY WITH LOGIC

TAOS058 − JANUARY 2004

6

r

r

Copyright

E 2006, TAOS Inc.

The

LUMENOLOGY

r Company

www.taosinc.com

MECHANICAL DATA

These assemblies consist of LED chips and a TTL MSI logic chip mounted on a header with a red molded plastic body.

Multiple displays may be mounted on 0.450-inch (11,43-mm) centers.

PACKAGE P

PLASTIC DUAL-IN-LINE

OF PIN 1

CL

0.150 (3,80)

OF PIN 1

CL

0.010 (0,25) NOM

4 Sides

0.070 (1,78)

0.270 (6,90)

0.170 (4,30)

0.160 (4,10)

Logic

Chip

0.160 (4,10)

0.015 (0,38)

Seating Plane

0.170 (4,32) MIN

0.420 (10,67)

0.380 (9,65)

0.140 (3,60)

0.110 (2,80)

0.022 (0,56)

0.018 (0,46)

0.075 (1,91) MAX

DIA All Pins

MAX

0.086 (2,16)

0.760 (19,31)

0.720 (18,29)

0.085 (2,16) MAX

0.075 (1,91) MAX

0.022 (0,56)

0.018 (0,46)

0.100 (2,54) TP

12 Places

(See Note B)

14

1

13

2

12

3

4

10

5

87

5

°

0.300 (7,62)

0.010 (0,26)

DIA All Pins

TOP VIEW

END VIEW

BOTTOM VIEW

NOTES: A. All linear dimensions are in inches and (parenthetically) in millimeters.

B. The true-position pin spacing is 0.100 (2,54) between centerlines. Each centerline is located within 0.010 ( 0,26) of its true

longitudinal position relative to pins 1 and 14.

C. Associated centerlines of character segments and decimal point dimensions are nominal.

D. This drawing is subject to change without notice.

Figure 5. Package P — Plastic Dual-In-Line Packaging Configuration