9 Device and Documentation Support

9.1 Device Support

9.1.1 Development Support

• SPICE-based analog simulation program — TINA-TI software folder

• Analog Engineers Calculator

9.1.1.1 PSpice® for TI

PSpice® for TI is a design and simulation environment that helps evaluate performance of analog circuits. Create

subsystem designs and prototype solutions before committing to layout and fabrication, reducing development

cost and time to market.

9.2 Documentation Support

9.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, EMI Rejection Ratio of Operational Amplifiers application report

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc.

PSpice® is a registered trademark of Cadence Design Systems, Inc.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (May 2023) to Revision D (November 2024)

Page

• Deleted the preview tag from Package Information for INA351 DDF RTM........................................................ 1

• Deleted the preview tag from Device Comparison Table for INA351 DDF RTM................................................ 3

• Deleted preview footnote from Thermal Information table for INA351 SOT-23-THIN (DDF) RTM.....................5

INA351

SBOSAD5D – DECEMBER 2022 – REVISED NOVEMBER 2024

www.ti.com

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Product Folder Links: INA351