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MAX3237ECAI Datasheet(PDF) 20 Page - Maxim Integrated Products

Part # MAX3237ECAI
Description  ±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
PDF  22 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX3237ECAI Datasheet(HTML) 20 Page - Maxim Integrated Products

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±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
20
______________________________________________________________________________________
Selector Guide
PART
NO. OF
DRIVERS/
RECEIVERS
LOW-POWER
SHUTDOWN
GUARANTEED
DATA RATE
(bps)
MAX3222E
2/2
✔
250k
MAX3232E
2/2
—
250k
MAX3237E
(Normal)
5/3
✔
250k
MAX3237E
(MegaBaud)
5/3
✔
1M
MAX3241E
3/5
✔
250k
MAX3246E
3/5
✔
250k
___________________ Chip Information
TRANSISTOR COUNT:
MAX3222E/MAX3232E: 1129
MAX3237E: 2110
MAX3241E: 1335
MAX3246E: 842
Ordering Information (continued)
PART
TEMP RANGE
PIN-PACKAGE
MAX3222ECWN
0°C to +70°C
18 Wide SO
MAX3222ECPN
0°C to +70°C
18 Plastic DIP
MAX3222EC/D
0°C to +70°C
Dice*
MAX3222EEUP
-40°C to +85°C
20 TSSOP
MAX3222EEAP
-40°C to +85°C
20 SSOP
MAX3222EEWN
-40°C to +85°C
18 Wide SO
MAX3222EEPN
-40°C to +85°C
18 Plastic DIP
MAX3232ECAE
0°C to +70°C
16 SSOP
MAX3232ECWE
0°C to +70°C
16 Wide SO
MAX3232ECPE
0°C to +70°C
16 Plastic DIP
MAX3232ECUP
0°C to +70°C
20 TSSOP
MAX3232EEAE
-40°C to +85°C
16 SSOP
MAX3232EEWE
-40°C to +85°C
16 Wide SO
MAX3232EEPE
-40°C to +85°C
16 Plastic DIP
MAX3232EEUP
-40°C to +85°C
20 TSSOP
MAX3237ECAI
0°C to +70°C
28 SSOP
MAX3237EEAI
-40°C to +85°C
28 SSOP
MAX3241ECAI
0°C to +70°C
28 SSOP
MAX3241ECWI
0°C to +70°C
28 Wide SO
MAX3241ECUI
0°C to +70°C
28 TSSOP
MAX3241ECGJ
0°C to +70°C
32 QFN
MAX3241EEAI
-40°C to +85°C
28 SSOP
MAX3241EEWI
-40°C to +85°C
28 Wide SO
MAX3241EEUI
-40°C to +85°C
28 TSSOP
MAX3246ECBX-T
0°C to +70°C
6 x 6 UCSP*
MAX3246EEBX-T
-40°C to +85°C
6 x 6 UCSP*
*Requires solder temperature profile described in the Absolute
Maximum Ratings section. UCSP Reliability is integrally linked
to the user’s assembly methods, circuit board material, and
environment. Refer to the UCSP Reliability Notice in the UCSP
Reliability section of this datasheet for more information.



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