ULN2003AI datasheet(18/42 Pages) TI

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8.3 System Examples

ULN2002A

P-MOS

Output

VSS

Figure 8-4. P-MOS to Load

ULQ2003A

Lam

Test

TTL

Output

VCC

Figure 8-5. TTL to Load

VDD

ULN2004A

ULQ2004A

CMOS

Output

Figure 8-6. Buffer for Higher Current Loads

VCC

ULQ2003A

TTL

Output

Figure 8-7. Use of Pullup Resistors to Increase

Drive Current

8.4 Power Supply Recommendations

This device does not need a power supply. However, the COM pin is typically tied to the system power supply.

When this is the case, it is very important to ensure that the output voltage does not heavily exceed the COM

pin voltage. This discrepancy heavily forward biases the fly-back diodes and causes a large current to flow into

COM, potentially damaging the on-chip metal or over-heating the device.

8.5 Layout

8.5.1 Layout Guidelines

Thin traces can be used on the input due to the low-current logic that is typically used to drive ULN2003A device.

Take care to separate the input channels as much as possible, as to eliminate crosstalk. TI recommends thick

traces for the output to drive whatever high currents that may be needed. Wire thickness can be determined by

the current density of the trace material and desired drive current.

ULN2002A, ULN2003A, ULN2003AI

ULQ2003A, ULN2004A, ULQ2004A

SLRS027S – DECEMBER 1976 – REVISED JUNE 2024

www.ti.com

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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULQ2003A ULN2004A ULQ2004A

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