OPA2674

SBOS270A − AUGUST 2003 − REVISED MAY 2006

www.ti.com

2

PRODUCT

PACKAGE−LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

OPA2674

SO-8

D

−40

°C to +85°C

OPA2674ID

OPA2674ID

Rails, 100

″

″

″

″

″

OPA2674IDR

Tape and Reel, 2500

OPA2674

SO-14

D

−40

°C to +85°C

OPA2674I-14D

OPA2674I

Rails, 58

″

″

″

″

″

OPA2674I-14DR

Tape and Reel, 2500

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

Power Supply

±6.5VDC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Power Dissipation

See Thermal Analysis

. . . . . . . . . . . . . .

Differential Input Voltage

±1.2V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input Common-Mode Voltage Range

±VS

. . . . . . . . . . . . . . . . . . . .

Storage Temperature Range: D,

−40

°C to +125°C

. . . . . . . . . . .

Lead Temperature (soldering, 10s)

+300

°C

. . . . . . . . . . . . . . . . . . . . .

Junction Temperature (TJ)

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Rating

Human Body Model (HBM)(2)

2000V

. . . . . . . . . . . . . . . . . . . . . .

Charge Device Model (CDM)

1000V

. . . . . . . . . . . . . . . . . . . . . .

Machine Model (MM)

100V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) Pins 2 and 6 on SO-8 package, and pins 1 and 7 on SO-14

package > 500V HBM.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PIN CONFIGURATIONS

Top View

SO-8

Top View

SO-14

NC = No Connection

1

2

3

4

8

7

6

5

+V

S

Out B

−In B

+In B

OPA2674ID

Out A

−In A

+In A

−V

S

1

2

3

4

5

6

7

14

13

12

11

10

9

8

−In A

+In A

A0

−V

S

A1

+In B

−In B

Out A

NC

NC

+V

S

NC

NC

Out B

Power

Control

OPA2674I−14D