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SPECIFICATION

SYSTEM

Processor

i.MX 8M plus applications processors

MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz, VPU/ISP/CAN FD, -40~105°C

MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz, VPU/ML/ISP/CAN FD, -40~105°C

Memory

2GB/4GB/8GB LPDDR4 Memory Down

GRAPHICS

Controller

GC7000UL

Feature

HW Decode: 1080p60 H.265,H.264, VP9, VP8

HW Endcode: 1080p60 H.265,H.264

Display

1 x HDMI

HDMI: resolution up to 1920x1080@60Hz

1 x LVDS

LVDS: resolution up to 1920x1200 @60Hz

Dual Display

LVDS + HDMI

Android:support single output

EXPENSION

Interface

1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0)

1 x M.2 E key 2230 (PCIe x1/USB 2.0)

1 x Nano SIM slot

AUDIO

Audio Codec

Audio codec SGTL5000

ETHERNET

Phy

AR8035

REAR I/O

Ethernet

2 x GbE (RJ-45)

Serial

1 x RS485 (2-wire)

USB

2 x USB 3.1 Gen1

2 x USB 2.0

Display

1 x HDMI

INTERNAL I/O

Serial

1 x RS232

1 x RS232/422/485 (2.0mm pitch)

USB

2 x USB 2.0 (2.00mm pitch, the 2nd USB is shared with M.2 B Key (default)

1 x Micro USB 2.0 (Download Mode)

Display

1 x LVDS LCD Panel connector

1 x LCD/Inverter Power

Audio

1 x Audio (Line-out/Mic-in)

SD

1 x uSD card

DIO

1 x 8-bit DIO

I2C

1 x I2C / Touch

CANBus

2 x CAN bus 2.0b on Industrial CPU sku

STORAGE

eMMC

1 x eMMC 5.1 with default 16GB (up to 64GB)

WATCHDOG TIMER

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

POWER

Type

Wide Range 9~36VDC

Note1: Support 9V~24VDC in -30~80°C operating temperature.

Note2: Support 36VDC within 70°C operating temperature.

Connector

2-pole terminal block (default)

Co-lay 4-pin vertical power connector

Consumption

Typical: i.MX 8M Plus Quad, 12V, 3.6Watt

Max.: i.MX 8M Plus Quad, 12V, 5.28Watt

RTC Battery

CR2032 Coin Cell

OS SUPPORT

Microsoft/Linux

Linux Yocto 3.0 (default)

Android 10

ENVIRONMENT

Temperature

Operating: -30 to 80 °C

Storage: -40 to 85°C

Humidity

Operating: 5 to 90% RH

Storage: 5 to 90% RH

MTBF

i.MX 8M Plus Quad: 632,710 hrs @ 25°C; 386,370 hrs @ 45°C ; 252,204 hrs @ 60°C; 138,544 hrs

@ 80°C

Calculation model: Telcordia Issue 4

Environment: GB, GC – Ground Benign, Controlled

MECHANISM

Dimensions

3.5" SBC Form Factor

146mm (5.75") x 102mm (4.02")

Height

PCB: 1.6mm

Top Side: 15mm

Bottom Side: 4mm

STANDARDS AND

CERTIFICATIONS

Certifications

CE, FCC, RoHS, UKCA

DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your

sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © September 8, 2023 DFI Inc.

PACKING LIST

OPTIONAL ITEMS

1 M8MP553 board

1 Terminal block for RS485 (COM3)

342-361021-000G

1 Heatsink (Height: 21mm)

A71-008168-000G

2 pole terminal to DC jack cable

A81-004013-000G

Power adapter (60W, 12V, DC Jack)

671-106012-000G

USB 2.0 cable (Length: 200mm)

A81-001032-016G

COM port cable (Length: 250mm, COM1/4)

A81-009595-016G

Audio (Length: 300mm)

A81-022031-016G

Heat spreader (Height: 11mm)

A71-808351-000G

Debug console with cable (Length: 500mm)

770-IMX8M1-000G

ORDERING INFORMATION

Model Name

P/N

Processor Memory eMMC GbE RS-232 RS-232/422/485 USB 3.1 Gen1 USB 2.0 Power

Thermal Temp.

M8MP553-ECC-41QDI 770-8MP5531-200G Quad core 4 GB

16 GB 2

1

1

2

4

9~36VDC Fanless -30 to 80°C

M8MP553-ECC-21DLI 770-8MP5531-300G Dual core 2 GB

16 GB 2

1

1

2

4

9~36VDC Fanless -30 to 80°C

M8MP553-ECC-81QDI 770-8MP5531-400G Quad core 8 GB

16 GB 2

1

1

2

4

9~36VDC Fanless -30 to 80°C