TORX147PL(F,T)

2006-12-28

4

(6)

Attaching the fiber optic receiving module

Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX147PL(F,T) to the printed

circuit board in order to fix it to the board.

(7)

Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to

pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off

using cotton tips.

(8)

Supply voltage

that supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.

(9)

Output

If the receiver output is at low and is connected to the power supply, or if the output is high and is

connected to GND, the internal IC may be destroyed.

(10) Soldering condition

Solder at 260°C or less for no more than ten seconds.

(11) Case(receptacle) material

The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and

aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone),

alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen,

or melted. Please take care when choosing a packaging material by referencing the table below.

〈

Chemicals to avoid with polycarbonate〉

PHENOMENON

CHEMICALS

A

Little deterioration

But staining

・

nitric acid(low concentration) , hydrogen peroxide, chlorine

B

Cracked crazed,

or Swollen

・

acetic acid(70% or more)

・

gasoline

・

methyl isobutyl ketone, ethyl acetate, butyl acetate

・

methyl methacrylate, ethyl ether, MEK

・

acetone, m-amino alcohol, carbon tetrachloride

・

carbon disulfide, trichloroethylene, cresol

・

thinners, oil of turpentine

・

triethanolamine

C

Melted

｛

｝

：

used as solvent

・

concentrated sulfuric acid

・

benzene

・

styrene, acrylonitrile, vinyl acetate

・

ethylenediamine, diethylenediamine

・

{chloroform, methyl chloride, tetrachloromethane, dioxane}

{1,2-dichloroethane}

D

Decomposed

・

ammonia water

・

other alkali

(12) Precautions when disposing of devices and packing materials.

When disposing devices and packing materials, follow the procedures stipulated by local regulations

in order to protect the environment against contamination.

(13) Precautions during use

Toshiba is continually working to improve the quality and the reliability of their products.

Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical

sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when

utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the

malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to

property.

When developing equipment, please ensure that Toshiba products are used within the specified

operating ranges set forth in the most recent product specifications. Also, please keep in mind the

precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.