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IL3022 Datasheet(PDF) 8 Page - NVE Corporation |
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IL3022 Datasheet(HTML) 8 Page - NVE Corporation |
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8 / 15 page ![]() IL3022 8 NVE Corporation 11409 Valley View Road, Eden Prairie, MN 55344 (952) 829-9217 www.nve.com YouTube.com/NveCorporation iso-apps@nve.com Electrostatic Discharge Sensitivity This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. Power Supply Decoupling VDD1 and VDD2 should be bypassed with 0.1 µF typical (0.047 µF minimum) capacitors as close as possible to the VDD pins. Maintaining Creepage Creepage distances are often critical in isolated circuits. In addition to meeting JEDEC standards, NVE isolator packages have unique creepage specifications. Standard pad libraries often extend under the package, compromising creepage and clearance. Similarly, ground planes, if used, should be spaced to avoid compromising clearance. Package drawings and recommended pad layouts are included in this datasheet. DC Correctness The IL3022 incorporates a patented refresh circuit to maintain the correct output state with respect to data input. At power up, the bus outputs will follow the Function Table shown on page 1 of this datasheet. The DE input should be held low during power-up to eliminate false drive data pulses from the bus. An external power supply monitor to minimize glitches caused by slow power-up and power-down transients is not required. Electromagnetic Compatibility The IL3022 is fully compliant with IEC 61000-6-1 and IEC 61000-6-2 standards for immunity, and IEC 61000-6-3, IEC 61000-6-4, CISPR, and FCC Class A standards for emissions. The IsoLoop Isolator’s Wheatstone bridge configuration and differential magnetic field signaling ensure excellent EM immunity. Immunity to external magnetic fields is even higher if the field direction is “end-to-end” (rather than to “pin-to-pin”) as shown at right . |
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