TLV755P datasheet(5/49 Pages) TI1

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5.4 Thermal Information

PCB

THERMAL METRIC(1) (2)

TLV755

UNIT

DYD

(SOT-23-5)

DQN

(X2SON)

DBV

(SOT-23-5)

DRV

(WSON)

5 PINS

4 PINS

5 PINS

6 PINS

EVM

RθJA

Junction-to-ambient thermal resistance

60.3

N/A

100.8

N/A

°C/W

ψJT

Junction-to-top characterization parameter

14.2

N/A

23.3

N/A

ψJB

Junction-to-board characterization parameter

35.9

N/A

67.8

N/A

JEDEC

RθJA

Junction-to-ambient thermal resistance

92.5

168.4

231.1

100.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

119.8

139.1

118.4

108.5

RθJB

Junction-to-board thermal resistance

45.8

101.4

64.4

64.3

ψJT

Junction-to-top characterization parameter

16.7

5.6

28.4

10.4

ψJB

Junction-to-board characterization parameter

44.9

101.7

63.8

64.8

RθJC(bot)

Junction-to-case (bottom) thermal resistance

34.3

88.4

N/A

34.7

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

(2)

JEDEC thermal metrics apply to JEDEC standard PCB (2s2p, no vias to internal plane and bottom layer). EVM metrics apply to the

LP087A EVM with an exposed pad SOT-23-5 (DYD) layout.

5.5 Electrical Characteristics

at operating temperature range (TJ =–40°C to 125°C), VIN=VOUT(NOM) + 0.5V or 2.0V (whichever is greater), IOUT = 1mA, VEN

= VIN, and CIN = COUT = 1μF (unless otherwise noted); all typical values at TJ = 25°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage

1.45

5.5

VOUT

Output voltage

0.6

5.0

Output accuracy

−40°C ≤ TJ ≤ +85°C, DBV and DRV package

−1

VOUT ≥ 1.0V, DQN package

−1.2

1.2

−40°C ≤ TJ ≤ +85°C; 0.6V ≤ VOUT < 1.0V

−10

VOUT ≥ 1V

−1.5

1.5

0.6V ≤ VOUT < 1V

-15

(ΔVOUT)ΔVIN

Line regulation

VOUT + 0.5V ≤ VIN ≤ 5.5V, VOUT > 1.5V

ΔVOUT/ΔIOUT

Load regulation

0.1mA ≤ IOUT

≤ 500mA

DQN package

0.036

V/A

DBV and DYD packages

0.060

DRV package

0.044

IGND

Ground current

TJ = 25°C, IOUT = 0mA

µA

−40°C ≤ TJ ≤ +85°C, IOUT = 0mA

−40°C ≤ TJ ≤ +125°C, IOUT = 0mA

ISHDN

Shutdown current

VEN ≤ 0.4V, 1.4V ≤ VIN ≤ 5.5V, −40°C ≤ TJ ≤ +125°C

0.1

µA

ICL

Output current limit

VIN = VOUT+

VDO(MAX) +

0.25V

VOUT = VOUT - 0.2V, VOUT ≤ 1.5V

560

720

865

VOUT = 0.9 x VOUT, 1.5V < VOUT ≤ 4.5V

560

720

865

ISC

Short-circuit current limit

VOUT = 0V

355

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TLV755P

SBVS320D – NOVEMBER 2017 – REVISED SEPTEMBER 2024

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