CMD262

26-28 GHz GaN Power Amplifier

Data Sheet Rev. A, June 14, 2022 | Subject to change without notice

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Mechanical Information

Die Outline (all dimensions in microns)

Notes:

1.

No connection required for unlabeled pads

2.

Backside is RF and DC ground

3.

Backside and bond pad metal: Gold

4.

Die is 100 microns thick

5.

RF bond pads (1, 3) are 100 x 150 microns

6.

DC bond pad (2) is 100 x 300 microns

7.

DC bond pads (4, 5, 6) are 100 x 150 microns